Publications

Recent publications (Selected)

Selected journal articles, reviews and flagship conference papers, arranged by publication year.

2026

Wan, S. Zhao, B. Tang, Z. G. Yu, Z. Fang, J. F. Leong, Z. Xu, Y.-W. Zhang, E. Zamburg and A. V.-Y. Thean, “Light Polarization-Based Electro-Optic Memory,” Nature Communications, 2026. Published 2 July 2026. doi.org/10.1038/s41467-026-75086-6

Li, Z. Xu, Y. Chen, C. Zeng, J. Yang, J. F. Leong, M. Sivan, B. Tang, Z. Wang, Y. Gao, H.-L. Lin, A. K. Mugilvannan, E. Zamburg, A. Danner, C.-W. Qiu, G. Eda and A. V.-Y. Thean, “Opto-Optical Edge Defect Mitigation in Solution-Processed WSe2 Thin Films for High-Efficiency Optical Modulation,” Nature Communications, vol. 17, article 7185, 2026. doi.org/10.1038/s41467-026-73576-1

2025

Yang, Z. Xu, C. Zeng, J. F. Leong, E. Zamburg and A. V.-Y. Thean, “High-Q Lithium Niobate Microrings Enabled by a Hybrid Dry Etching and Wet Polishing Technique,” CLEO 2025, Technical Digest Series, Optica Publishing Group, paper JPS200_46, 2025. doi.org/10.1364/CLEO_AT.2025.JPS200_46

Tang, X. Chen, R. Wan, Z. G. Yu, S. Hooda, W. Wang, Z. Fang, Q. Wan, M. Sivan, E. Zamburg, Y.-W. Zhang, X. Gong and A. V.-Y. Thean, “First Demonstration of Fluorine-Treated IGZO FETs with Record-Low Positive Bias Temperature Instability (|Delta VTH| < 44 mV) at an Elevated Temperature (395 K),” 2025 Symposium on VLSI Technology and Circuits, Kyoto, Japan, pp. 1-3, 2025. doi.org/10.23919/VLSITechnologyandCir65189.2025.11075017

Zhao, Z. Xu, J. Yang, Y. Li, E. Zamburg, R. Nagarajan and A. V.-Y. Thean, “A 2-Transistor-1-Modulator (2T1M) Electronic-Photonic Hybrid Memory Architecture for Deep Neural Network CIM and Very Large-Scale Transformers,” 2025 Symposium on VLSI Technology and Circuits, Kyoto, Japan, pp. 1-3, 2025. doi.org/10.23919/VLSITechnologyandCir65189.2025.11075020

F. Leong, M. Sivan, J. Pan, Z. Fang, J. Li, Z. Xu, S. Zhao, Q. Wan, E. Zamburg and A. V.-Y. Thean, “Opportunities for 2D-Material-Based Multifunctional Devices and Systems in Bioinspired Neural Networks,” Small, article e06638, 2025. doi.org/10.1002/smll.202506638

Yang, A. Yan, J. F. Leong, C. Zeng, J. Pan, S. Zhao, G. Zhang, Z. Xu, B. Xu, T. Yu, X. Cheng, S. Hooda, E. Zamburg, B. C.-K. Tee and A. V.-Y. Thean, “Heterogeneous Integration of Performant Lithium Niobate-on-Silicon Micro-Ring Modulator by High-Precision Micro-Transfer Printing,” 2025 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, pp. 1-4, 2025. doi.org/10.1109/IEDM50572.2025.11353731

Xing, B. Tang, S. Zhao, Q. Wan, J. F. Leong, Q. Nie, Y. Zhou, Z. Hong, E. Zamburg, W. Sun, D. Yang and A. V.-Y. Thean, “Tunable Volatile and Nonvolatile Switching in Silicon Nanosheets Memristor Array for Reservoir Computing,” Device, vol. 3, no. 9, article 100905, 2025. doi.org/10.1016/j.device.2025.100905

Xu, C.-K. Chen, H.-L. Lin, M. Sivan, E. Zamburg, J. Y.-M. Lee, S. Venkatesan, A. Danner and A. V.-Y. Thean, “Ferroelectric-Based Pockels Photonic Memory,” Nature Communications, vol. 16, article 8329, 2025. doi.org/10.1038/s41467-025-63850-z

Ji, B. Tang, J. Wang, H. Zheng, Z. Weng, Y. Wu, S. Li, A. V.-Y. Thean and K.-W. Ang, “High-Speed and Low-Energy Resistive Switching with Two-Dimensional Cobalt Phosphorus Trisulfide for Efficient Neuromorphic Computing,” ACS Nano, vol. 19, no. 1, pp. 722-735, 2025. doi.org/10.1021/acsnano.4c11890

Liu, H. Guo, Y. J. Tan, K. Yu, Q. Guan, E. Zamburg, W. Cheng, X. Wang, L. Zhou, H. Chen, Y. Jin, X. Cheng, F.-C. Liang, B. Tang, H. P. A. Ali, J. Yang, C. He, Y. Cai, A. V.-Y. Thean, Z. L. Wang and B. C. K. Tee, “Recyclable Self-Secreting Autonomous Healing Dielectrics for Millisecond Water Quality Sensing,” Nature Communications, vol. 16, article 5524, 2025. doi.org/10.1038/s41467-025-59973-y

Zhao, Y. Li, J. Pan, E. Zamburg and A. V.-Y. Thean, “In-Memory Subnet Computation for Area and Energy Efficient AI,” AI4X 2025 Conference, Singapore, 8-11 July 2025. openreview.net/forum?id=n1JeKxsB8Y

Li, Z. Xu, Y. Chen, J. F. Leong, M. Sivan, E. Zamburg, C.-W. Qiu, G. Eda and A. V.-Y. Thean, “Electrically Tunable Edge Defects for Electro-Optic Modulation in WSe2,” 2025 IEEE Semiconductor Interface Specialists Conference (SISC), San Diego, CA, USA, paper 4.18, 2025.

2024

Tang, Z. Fang, R. Wan, S. Hooda, J. F. Leong, Q. Wan, C.-K. Chen, E. Zamburg, J.-S. Kim and A. V.-Y. Thean, “1T1R and 2T0C1R IGZO-MoS2 All-BEOL 3D Memory Cells,” 2024 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, pp. 1-4, 2024. doi.org/10.1109/IEDM50854.2024.10873575

Tang, M. Sivan, J. F. Leong, Z. Xu, Y. Zhang, J. Li, R. Wan, Q. Wan, E. Zamburg and A. V.-Y. Thean, “Solution-Processable 2D Materials for Monolithic 3D Memory-Sensing-Computing Platforms: Opportunities and Challenges,” npj 2D Materials and Applications, vol. 8, article 74, 2024. doi.org/10.1038/s41699-024-00508-2

Zhang, X. T. Zheng, X. Zhang, J. Pan and A. V.-Y. Thean, “Hybrid Integration of Wearable Devices for Physiological Monitoring,” Chemical Reviews, vol. 124, no. 18, pp. 10386-10434, 2024. doi.org/10.1021/acs.chemrev.3c00471

Ghosh, “Efficient Machine Learning-Assisted Failure Analysis Method for Circuit-Level Defect Prediction,” Machine Learning with Applications, vol. 16, article 100537, 2024. doi.org/10.1016/j.mlwa.2024.100537

Jani, J. Harrison, S. Hooda, S. Prakash, P. Nandi, J. Hu, Z. Zeng, J.-C. Lin, C. Godfrey, G. J. Omar, T. A. Butcher, J. Raabe, S. Finizio, A. V.-Y. Thean, A. Ariando and P. G. Radaelli, “Spatially Reconfigurable Antiferromagnetic States in Topologically Rich Free-Standing Nanomembranes,” Nature Materials, vol. 23, no. 5, pp. 619-626, 2024. doi.org/10.1038/s41563-024-01806-2

2023

C.-K. Chen, Z. Xu, S. Hooda, J. Pan, E. Zamburg and A. V.-Y. Thean, “Negative-U Defect Passivation in Oxide-Semiconductor by Channel Defect Self-Compensation Effect to Achieve Low Bias Stress VTH Instability of Low-Thermal-Budget IGZO TFT and FeFETs,” 2023 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, pp. 1-4, 2023. doi.org/10.1109/IEDM45741.2023.10413688

Xu, C.-K. Chen, H.-L. Lin, Y. Gao, W. Ke, B. Xu, P. Dmitriev, C. Arbiz, E. Zamburg and A. V.-Y. Thean, “First Demonstration of HZO-LNOI Integrated Ferroelectric Electro-Optic Modulator and Memory to Enable Reconfigurable Photonic Systems,” 2023 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, pp. 1-4, 2023. doi.org/10.1109/IEDM45741.2023.10413812

F. Leong, Z. Fang, M. Sivan, J. Pan, B. Tang, E. Zamburg and A. V.-Y. Thean, “N-P Reconfigurable Dual-Mode Memtransistors for Compact Bio-Inspired Feature Extractor with Inhibitory-Excitatory Spiking Capability,” Advanced Functional Materials, vol. 33, no. 45, article 2302949, 2023. doi.org/10.1002/adfm.202302949

C.-K. Chen, S. Hooda, Z. Fang, M. Lal, Z. Xu, J. Pan, S.-H. Tsai, E. Zamburg and A. V.-Y. Thean, “High-Performance Top-Gated and Double-Gated Oxide-Semiconductor Ferroelectric Field-Effect Transistor Enabled by Channel Defect Self-Compensation Effect,” IEEE Transactions on Electron Devices, vol. 70, no. 4, pp. 2098-2105, 2023. doi.org/10.1109/TED.2023.3242633

Luo et al., including A. V.-Y. Thean, “Technology Roadmap for Flexible Sensors,” ACS Nano, vol. 17, no. 6, pp. 5211-5295, 2023. doi.org/10.1021/acsnano.2c12606

Liu, Y. Wen, C. F. Siah, M. E. Pam, B. Xu, A. V.-Y. Thean, Y. K. Lim and S. Shin, “A Dual-Domain 3omega Method for Measuring the In-Plane Thermal Conductivity of High-Conductive Thin Films,” Applied Physics Letters, vol. 122, no. 25, 2023. doi.org/10.1063/5.0154177

C. K. Goh, C. F. Siah, B. Xu, Y. Zhang, M. E. Pam, E. Guevarra, E. S. P. Goh, et al., including A. V.-Y. Thean, “Multi-Axial Elastic Averaging for Sub-Micron Passive Alignment of Photonic Components,” Journal of Lightwave Technology, vol. 41, no. 12, pp. 3986-3992, 2023. doi.org/10.1109/JLT.2023.3279319

2022

Thean, S.-H. Tsai, C.-K. Chen, M. Sivan, B. Tang, S. Hooda, Z. Fang, J. Pan, J. F. Leong, H. Veluri and E. Zamburg, “Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications,” 2022 IEEE International Electron Devices Meeting (IEDM), pp. 12.2.1-12.2.4, 2022. doi.org/10.1109/IEDM45625.2022.10019511

C.-K. Chen, Z. Fang, S. Hooda, M. Lal, U. Chand, Z. Xu, J. Pan, S.-H. Tsai, E. Zamburg and A. V.-Y. Thean, “First Demonstration of Ultra-Low Dit Top-Gated Ferroelectric Oxide-Semiconductor Memtransistor with Record Performance by Channel Defect Self-Compensation Effect,” 2022 IEEE International Electron Devices Meeting (IEDM), pp. 6.1.1-6.1.4, 2022. doi.org/10.1109/IEDM45625.2022.10019440

Xu, B. Tang, X. Zhang, J. F. Leong, J. Pan, S. Hooda, E. Zamburg and A. V.-Y. Thean, “Reconfigurable Nonlinear Photonic Activation Function for Photonic Neural Network Based on Non-Volatile Opto-Resistive RAM Switch,” Light: Science & Applications, vol. 11, article 288, 2022. doi.org/10.1038/s41377-022-00976-5

S.-H. Tsai, Z. Fang, X. Wang, U. Chand, C.-K. Chen, S. Hooda, M. Sivan, J. Pan, E. Zamburg and A. V.-Y. Thean, “Stress-Memorized HZO for High-Performance Ferroelectric Field-Effect Memtransistor,” ACS Applied Electronic Materials, vol. 4, no. 4, pp. 1642-1650, 2022. doi.org/10.1021/acsaelm.1c01321

Sivan, J. F. Leong, J. Ghosh, B. Tang, J. Pan, E. Zamburg and A. V.-Y. Thean, “Physical Insights into Vacancy-Based Memtransistors: Toward Power Efficiency, Reliable Operation, and Scalability,” ACS Nano, vol. 16, no. 9, pp. 14308-14319, 2022. doi.org/10.1021/acsnano.2c04504

Tang, H. Veluri, Y. Li, Z. G. Yu, M. Waqar, J. F. Leong, M. Sivan, E. Zamburg, et al., including A. V.-Y. Thean, “Wafer-Scale Solution-Processed 2D Material Analog Resistive Memory Array for Memory-Based Computing,” Nature Communications, vol. 13, article 3037, 2022. doi.org/10.1038/s41467-022-30519-w

Pan, Z. Yang, S. H. K. Yap, X. Zhang, Z. Xu, Y. Li, Y. Luo, E. Zamburg, et al., “Non-Destructive Online Seal Integrity Inspection Utilizing Autoencoder-Based Electrical Capacitance Tomography for Product Packaging Assurance,” Food Packaging and Shelf Life, vol. 33, article 100919, 2022. doi.org/10.1016/j.fpsl.2022.100919

H. K. Yap, J. Pan, D. V. Linh, X. Zhang, X. Wang, W. Z. Teo, E. Zamburg, et al., “Engineered Nucleotide Chemicapacitive Microsensor Array Augmented with Physics-Guided Machine Learning for High-Throughput Screening of Cannabidiol,” Small, vol. 18, no. 22, article 2107659, 2022. doi.org/10.1002/smll.202107659

2021

Pan, Y. Li, Y. Luo, X. Zhang, X. Wang, D. L. T. Wong, C. H. Heng, C. K. Tham, et al., including A. V.-Y. Thean, “Hybrid-Flexible Bimodal Sensing Wearable Glove System for Complex Hand Gesture Recognition,” ACS Sensors, vol. 6, no. 11, pp. 4156-4166, 2021. doi.org/10.1021/acssensors.1c01698

Veluri, Y. Li, J. X. Niu, E. Zamburg and A. V.-Y. Thean, “High-Throughput, Area-Efficient, and Variation-Tolerant 3-D In-Memory Compute System for Deep Convolutional Neural Networks,” IEEE Internet of Things Journal, vol. 8, no. 11, pp. 9219-9232, 2021. doi.org/10.1109/JIOT.2021.3058015

Pan, K. L. Low, J. Ghosh, S. Jayavelu, M. M. Ferdaus, S. Y. Lim, E. Zamburg, Y. Li, B. Tang, X. Wang, J. F. Leong, S. Ramasamy, T. Buonassisi, C. K. Tham and A. V.-Y. Thean, “Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS Transistors,” ACS Applied Nano Materials, vol. 4, no. 7, pp. 6903-6915, 2021. doi.org/10.1021/acsanm.1c00960

Han, Q. Kong, Y. Kang, C. Sun, C. Wang, J. Zhang, H. Xu, S. Samanta, J. Zhou, H. Wang, A. V.-Y. Thean and X. Gong, “Indium-Gallium-Zinc-Oxide (IGZO) Nanowire Transistors,” IEEE Transactions on Electron Devices, vol. 68, no. 12, pp. 6610-6616, 2021. doi.org/10.1109/TED.2021.3113893

Samanta, K. Han, C. Sun, C. Wang, A. Kumar, A. V.-Y. Thean and X. Gong, “Amorphous InGaZnO Thin-Film Transistors with Sub-10-nm Channel Thickness and Ultrascaled Channel Length,” IEEE Transactions on Electron Devices, vol. 68, no. 3, pp. 1050-1056, 2021. doi.org/10.1109/TED.2020.3048920

Liao, W. Song, X. Zhang, H. Jin, S. Liu, Y. Wang, A. V.-Y. Thean and Y. Zheng, “An Artificial Peripheral Neural System Based on Highly Stretchable and Integrated Multifunctional Sensors,” Advanced Functional Materials, vol. 31, no. 24, article 2101107, 2021. doi.org/10.1002/adfm.202101107

Chand, Z. Fang, C.-K. Chen, Y. Luo, H. Veluri, M. Sivan, J. F. Leong, et al., including A. V.-Y. Thean, “2-kbit Array of 3-D Monolithically-Stacked IGZO FETs with Low SS, Ultra-Low Leakage, Competitive Mobility and Novel nMOS-Only Circuit Demonstration,” 2021 Symposium on VLSI Technology, pp. 1-2, 2021.

Keynotes/Invited Talks

2022

(Keynote/Distinguished Speaker) Aaron Thean, “Materials-Device-System Co-Design for Analog-Non-Volatile-Memory-Based In-Memory Computing for Edge-AI,” Distinguished speaker at IBM IEEE CAS/EDS – AI Compute Symposium at IBM Yorktown Heights, New York, USA 12 -13 October 2022 (https://www.zurich.ibm.com/thinklab/AIcomputesymposium.html)

(Keynote/Distinguished Speaker) Aaron Thean, “Materials-Device-System Co-Design for Analog-Non-Volatile-Memory-Based In-Memory Computing for Edge-AI,” IEEE International Workshop for Future Intelligent Circuits and Systems (IW-FICAS) 2022, Singaore. https://ewh.ieee.org/r10/singapore/cas/workshops.html

(Invited Speaker) Aaron Thean, ” Materials Engineering of Oxide Semiconductors and 2D Materials for Novel Memory-Centric 3D-Integrated Circuits,’ Invited Speaker, Session TuA2  Formation and Characterization of Nanostructures I,Tuesday, September 6, 2022, TuA2-1 (Time: 10:40 – 11:10 JST), ISCSI-IX, 9th International Symposium on Control of Semiconductor Interfaces, September 5 (Mon.) - 8 (Thu.), 2022, Nagoya University, Nagoya, Japan, http://iscsi9.org/

2021

(Keynote/Distinguished Speaker) Aaron Thean, “Low-Thermal Budget Functional Material and their Application to EnhanceFlexible and Beyond Electronics,” KAUST Research Open Week, with the theme of Sustainability: Science for the Future., Nov28-Dec 2 2021, https://researchopenweek.kaust.edu.sa/speakers

(Keynote/Distinguished Speaker)  Aaron Thean,  “Low-Thermal Budget Functional Material and their Application to Enhance Flexible and Beyond Electronics,” International Conference on Flexible and Printed Electronics (ICFPE) 2021, https://www.eng.niigata-u.ac.jp/~icfpe/files/ProgramPlenary.pdf

(Keynote/Distinguished Speaker)  Aaron Thean,  “What’s wrong with my chip? – Dr. AI, can you please diagnose?,” IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IEEE IPFA 2021, Singapore, https://ipfa-ieee.org/2021/speaker-tag/Keynote/

Recent Patents (Selected)

2022

WO WO2022124993A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2020-12-11 • Filed 2021-12-10 • Published 2022-06-16

A memory device for deep neural network, DNN, accelerators, a method of fabricating a memory device for deep neural network, DNN, accelerators, a method of convoluting a kernel [A] with an input feature map [B] in a memory device for a deep neural network, DNN, accelerator, a memory device for a …

2021
 

WO WO2021107884A1 Aaron Voon-Yew THEAN National University Of Singapore

Priority 2019-11-28 • Filed 2020-11-27 • Published 2021-06-03

A pressure sensor and a method of sensing pressure using the pressure sensor. the pressure sensor comprises a sensor element array, each sensor element comprising two opposing electrode elements; and a porous mat disposed between the two opposing electrode elements of the sensor element; wherein …

 

WO WO2021040617A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2019-08-23 • Filed 2020-08-21 • Published 2021-03-04

Disclosed is a wearable body (100) comprising (i) one or more electrodes (102) positioned at a location at which a non- contact gesture, performed by a wearer when wearing the wearable body, is detectable by the sensor device, (ii) an excitation source (104) for supplying an excitation signal to …

 

WO WO2021029825A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2019-08-15 • Filed 2020-08-06 • Published 2021-02-18

A method and system for integrity testing of packages. The method comprises the steps of disposing at least a portion of the package relative to a multi-electrodes structure, the multi-electrodes structure comprising at least first and second arrays of electrodes; applying an AC bias voltage to …

2020
 

WO WO2020046207A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2018-08-31 • Filed 2019-08-28 • Published 2020-03-05

A method and system for integrity testing of a blister package. The method comprises the steps of providing an electrode structure comprising at least one pair of electrodes; disposing a blister of the blister package relative to the electrode structure such that the blister is subjectable to an …

 

WO WO2020027727A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2018-07-30 • Filed 2019-07-29 • Published 2020-02-06

A method and system for integrity testing of cup packages. The method comprises the steps of disposing at least a portion of a seal area of the cup package relative to an electrode structure; applying an AC bias voltage to the electrode structure; measuring an electrical property of the portion of …

2019
 

WO US CN SG WO2019209180A1 Voon Yew Aaron THEAN National University Of Singapore

Priority 2018-04-27 • Filed 2019-04-24 • Published 2019-10-31

A method and system for integrity testing of sachets. The method comprises the steps of disposing at least a portion of the sachet relative to an electrode structure; applying an AC bias voltage to the electrode structure; measuring an electrical property of the portion of the sachet over a …